Hirokazu Sasaki, Hideo Nishikubo, Shinsuke Nishida, S米兰体育中国官方网站oshi Yamazaki, Ryusuke Nakasaki, Takemi Isom米兰体育中国官方网站su,
Ryuichiro Min米兰体育中国官方网站o, Kohei Kinugawa, Akihiro Imamura, Shinya Otomo, Yujin Hori, Kiyoshige Hirose, S米兰体育中国官方网站oshi Anada,
Kazuo Yamamoto, Tsukasa Hirayama, Jun Yamasaki, Naoya Shib米兰体育中国官方网站a, Yojiro Oba, Mas米兰体育中国官方网站o Ohnuma
Abstract
Several cases using advanced analysis technology including electron microscope, synchrotron radiation, and surface analysis 米兰体育中国官方网站 various new materials/ products are introduced. Electron holography and the Differential Phase Contrast-Scanning Transmission Electron Microscopy (DPC-STEM) were used 米兰体育中国官方网站 the analysis of a semiconductor laser diode 米兰体育中国官方网站 optical communication. 3D analysis with Focused Ion Beam-Scanning Electron Microscopy (FIB-SEM) was utilized 米兰体育中国官方网站 analyzing winding wire with a micro cellular coating. The Small Angle X-ray Scattering (SAXS) method was used at Super Photon-ring-8-GeV (SPring-8) 米兰体育中国官方网站 analyzing a coated superconductor tape and a copper alloy. The surface analysis method of Hard X-ray Photoelectron Spectroscopy (HAXPES) was utilized 米兰体育中国官方网站 analyzing the AuSn solder.
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