Hirokazu Sasaki, Hideo Nishikubo, Shinsuke Nishida, Satoshi Yamazaki, Ryusuke Nakasaki, Takemi Isomatsu,
Ryuichiro Minato, Kohei Kinugawa, Akihiro Imamura, Shinya Otomo, Yujin Hori, Kiyoshige Hirose, Satoshi Anada,
Kazuo Yamamoto, Tsukasa Hirayama, Jun Yamasaki, Naoya Shibata, Yojiro Oba, Masato Ohnuma
Abstract
Several cases using advanced analysis technology including electron microscope, synchrotron radiation, and surface analysis 米兰体育中国官方网站 various new materials/ products are introduced. Electron holography and the Differential Phase Contrast-Scanning Transmission Electron Microscopy (DPC-STEM) were used 米兰体育中国官方网站 the analysis of a semiconductor laser diode 米兰体育中国官方网站 optical communication. 3D analysis with Focused Ion Beam-Scanning Electron Microscopy (FIB-SEM) was utilized 米兰体育中国官方网站 analyzing winding wire with a micro cellular coating. The Small Angle X-ray Scattering (SAXS) method was used at Super Photon-ring-8-GeV (SPring-8) 米兰体育中国官方网站 analyzing a coated superconductor tape and a copper alloy. The surface analysis method of Hard X-ray Photoelectron Spectroscopy (HAXPES) was utilized 米兰体育中国官方网站 analyzing the AuSn solder.
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