国际米兰中文官网 No.54The Development of Heat-Pipe for Top Heat

Saki Takada, Masahiro Uekubo

Along with improvement of performance of electronic devices, thermal problems caused by the high heat generation and the high-density packaging have been widely recognized and 国际米兰中文官网 measures have become important subjects. 国际米兰中文官网 design has been diversified and our improvement of the heat pipe performance at the top heat condition will contribute to the improvement of flexibility in 国际米兰中文官网 design. We analyzed the pressure drop in heat pipes and applied copper powder which had a high capillary pressure and copper short fiber which had a high transmission rate to their wick, and we have successfully developed the heat pipe which improved its performance lowered by gravity to raise its heat transfer rate. In this paper, we will introduce our technology about the heat pipe for the top heat condition.