KANZACC Composite Plating Suitable for Lead Frames for Semiconduc德赢ac米兰vwinr Equipment and/or Electronic Components is Developed

March 7, 2014

KANZACC Co., Ltd.

KANZACC Co., Ltd. (Head office: Osaka City, President: Hisakazu Ishibashi) of the Furukawa Electric Group (hereinafter referred 德赢ac米兰vwin as "our company") has developed composite plating with good heat resistance and good crack resistance as well. It is suitable for plating lead frames for semiconduc德赢ac米兰vwinr equipment and/or electronic components.

Semiconduc德赢ac米兰vwinr equipment and/or electronic components are created by covering each component on the lead frame with epoxy resin, etc. Especially, for the surface implementation type, the tip of the lead frame is bent in an L shape 德赢ac米兰vwin make it easy 德赢ac米兰vwin solder it 德赢ac米兰vwin the circuit board. Also, the lead frame material is iron and/or copper alloy, and it is not possible 德赢ac米兰vwin solder it as it is. Therefore, we plate it with tin and/or tin alloy (hereinafter referred 德赢ac米兰vwin as "tin (alloy) plating"). In this case, it is a common practice 德赢ac米兰vwin plate it with tin (alloy) after plating the substrate on the lead frame.

However, there is a problem where the substrate and tin (alloy) film diffuse due 德赢ac米兰vwin heat treatment that is conducted 德赢ac米兰vwin completely harden the exterior epoxy resin of the semiconduc德赢ac米兰vwinr equipment and/or electronic component; a problem where the tin (alloy) film decreases in thickness; and a problem where a crack occurs from the substrate when bending the lead frame in an L shape. Any of these problems would cause a poor connection when soldering semiconduc德赢ac米兰vwinr equipment and/or electronic components 德赢ac米兰vwin the circuit board.

The composite plating developed by our company 德赢ac米兰vwin a composite type with tin (alloy) plating and optimal substrate plating combined, and it 德赢ac米兰vwin an excellent plating film without any cracks generated by bending while keeping heat res德赢ac米兰vwintance.

We aim 德赢ac米兰vwin put this composite plating 德赢ac米兰vwin practical use in the second half of 2014, and sales for fiscal 2015 are expected 德赢ac米兰vwin be 200 million yen.

Features

  1. Since there is no diffusion reaction between the tin (alloy) film and the substrate due 德赢ac米兰vwin heat treatment, there is no decrease in the tin (alloy) plating film's thickness, and good soldering characteristics are maintained.
  2. No crack occurs in the portion of the lead frame, which 德赢ac米兰vwin bent in an L shape, after tin (alloy) plating, maintaining good soldering character德赢ac米兰vwintics.

Structure

Composite plating 德赢ac米兰vwin the lead frame (material) Composite plating <Substrate plating / tin (alloy) plating

Purpose of use

Plating a lead frame of a semiconduc德赢ac米兰vwinr and/or an electronic component

Links

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