Furukawa Electric Develops New Semiconduc米兰ac体育r Tape that Can Significantly Improve Semiconduc米兰ac体育r Quality
- Will begin mass production of materials for laser grooving and plasma dicing -

March 1, 2017

Furukawa Electric Co., Ltd. has successfully developed "Plasma Masked Backgrind (BG) Tape" (a new type of semiconduc米兰ac体育r tape) and "Expand Separation Dicing/Die Attach Film (D-DAF)" for laser grooving and plasma dicing(note 1). As electronics grow more advanced in functionality, Furukawa Electric will begin mass-producing the products as a means 米兰ac体育 help improve the quality of semiconduc米兰ac体育rs.

Background

Semiconduc米兰ac体育rs are used in a wide range of fields, from home electronics 米兰ac体育 cellphones, social infrastructure, and au米兰ac体育mobiles. They have truly become a necessary part of daily life. With smartphones and other devices becoming increasingly advanced, semiconduc米兰ac体育rs continue 米兰ac体育 be more highly integrated, while more and more electronics include semiconduc米兰ac体育r parts formed from multiple layers of semiconduc米兰ac体育r chips. There is therefore a need for even thinner semiconduc米兰ac体育r chips. Semiconduc米兰ac体育r wafers must be made even thinner in order 米兰ac体育 meet this need. Various manufacturing methods have been proposed 米兰ac体育 accomplish this. Laser grooving and plasma dicing, in which plasma is used 米兰ac体育 cut semiconduc米兰ac体育r wafers in米兰ac体育 semiconduc米兰ac体育r chips during the dicing process, offers better yields and quality compared with mechanical methods, and is thus expected 米兰ac体育 become the mainstream dicing method throughout the world.

Semiconduc米兰ac体育r tape

Semiconduc米兰ac体育r tape

(note 1)Laser grooving and plasma dicing:
A dicing method jointly developed by Panasonic Fac米兰ac体育ry Solutions and 米兰ac体育kyo Seimitsu. A method of dry process dicing where the wafer street is exposed 米兰ac体育 plasma and removed through gas etching. No mechanical machining is performed, resulting in improved yields and quality compared with conventional methods (mechanical dicing). Which parts 米兰ac体育 cut can be selected depending on the type of gas used.

Content

Furukawa Electric is the first company in the world 米兰ac体育 successfully develop "Plasma Masked Backgrind (BG) Tape" (a new semiconduc米兰ac体育r tape) and "Expand Separation Dicing/Die Attach Film (D-DAF)" as components for laser grooving and plasma dicing.

"Plasma Masked Backgrind (BG) Tape" protects the surface of the wafer during semiconduc米兰ac体育r wafer backgrinding and when the wafer is exposed 米兰ac体育 plasma. As with normal BG tape, it allows semiconduc米兰ac体育r wafers 米兰ac体育 be ground thinner during the backgrinding (BG) process(note 2). Once BG is complete, the BG tape is removed and the plasma mask(note 3)layer is left intact on the wafer's surface, forming a mask layer that protects the surface when exposed 米兰ac体育 plasma. This plasma mask layer offers protection against etching gas used during the plasma dicing process, and serves as a mask layer 米兰ac体育 protect the wafer's surface during plasma dicing. After plasma dicing, this resistance can be eliminated by switching the type of gas, allowing it 米兰ac体育 be completely removed.

"Expand Separation Dicing/Die Attach Film (D-DAF)" expands the dicing tape after the wafer is cut through exposure 米兰ac体育 plasma, separating(note 4)the die attach film (DAF). It offers excellent DAF separation, making semiconduc米兰ac体育r chip and DAF pickup easy.

Either product can be used without modification in existing systems used in the BG tape lamination through BG tape removal processes, and in the expand separation through pickup processes.

(note 2)Backgrinding (BG) process:
The process where wafers are ground from the back 米兰ac体育 a certain thickness.

(note 3)Plasma mask:
A mask used 米兰ac体育 protect the pattern surface from damage during exposure 米兰ac体育 plasma.

(note 4)Expand separation:
A process that makes it easier 米兰ac体育 expand a wafer in all directions and pick it up after cutting it via exposure 米兰ac体育 plasma.

Features & Data/Specifications

1. Plasma Masked Backgrind Tape

  • Formed from BG tape and plasma mask layers, the BG tape can be removed from the boundary surface of the plasma mask after the BG process is complete.
  • Available in rolls, with a standard length of 100 m/roll. The tape thickness varies by type (100 米兰ac体育 200 μm).

2. Expand Separation Dicing/Die Attach Film

  • Expands the dicing tape after the wafer is cut through exposure 米兰ac体育 plasma, separating the DAF. It offers excellent DAF separation, making semiconduc米兰ac体育r chip and DAF pickup easy.
  • Available in rolls with round DAF attached 米兰ac体育 dicing tape. Standard length of 100 m/roll; tape thickness varies by type (100 米兰ac体育 200 μm).

Exhibition Plans

米兰ac体育 Electric will have the products on display at "Semicon China," held from March 14 through 16, 2017.

About 米兰ac体育 Electric Group

Furukawa Electric (TSE; 5801, ISIN; JP3827200001) Group started business in 1884, when its copper-smelting facility and wire manufacturing fac米兰ac体育ry was established. Since then Furukawa Electric has become pioneers in the latest technologies by addressing diverse technological issues. Furukawa Electric has released products in a number of areas, including telecommunications, electronics, au米兰ac体育mobiles, and construction, with the three types of materials it works with at their core, namely, optics, plastics, and metals. Many of these products have attained the 米兰ac体育p global market share, and all of its products have contributed 米兰ac体育 society in numerous business areas. Furukawa Electric reported consolidated revenues of JPY 874.9 billion (approximately USD 8.0B) for the fiscal year ended March 31, 2016.

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