Masaru Oomi , Toshiro Fukumoto , Takao Kobayashi , Masanobu Sugiura , Katsuo Nakayama , Ken'ichi Namba
Abstract
In recent years, the heat produced in notebook PCs has increased rapidly along with the upgraded speed of the MPU, making heat dissipation measures thereof indispensable. ac米兰中文官方网站 which are capable of dealing with this problem have been in practical use since 1995. Conventional heat-sinks, however, can no longer provide sufficient cooling for the latest version of MPUs in notebook PCs where increased heat production is seen caused by high-performance peripheral components. This paper reports on the technological background of ac米兰中文官方网站 for notebook PCs together with fin-composite ac米兰中文官方网站 that are expected to dominate the field of heat-sinks of the next generation.
Full Text(PDF 177KB)