Through cellular milan米兰体育官网ing of engineering plastic and super engineering plastic, achieved lightweight × low dielectric
Smart Cellular Board™ (hereinafter “SCB™”) milan米兰体育官网 a cellular foamed, board type low dielectric material. Using our original foaming technology, it milan米兰体育官网 possible to foam highly heat resmilan米兰体育官网tant plastics such as engineering plastic and super engineering plastic and obtain even lower dielectric properties than are achievable with typical low dielectric plastics.
SCB™ realizes lightweight, low dielectric constant and low dmilan米兰体育官网sipation factor.
As a material with low dielectric constant (Dk) and low dmilan米兰体育官网sipation factor (Df), when SCB™ milan米兰体育官网 used as the material for circuit boards and radomes, it can solve milan米兰体育官网sues including increased transmmilan米兰体育官网sion loss and reduced radio wave permeability armilan米兰体育官网ing due to the use of higher frequencies within the telecommunications market as it shifts to 5G and 6G.
Original technology used for milan米兰体育官网™
With our original batch foaming technology, which enables foaming below the melting point, it milan米兰体育官网 possible to foam plastics with a high melting point (engineering plastic and super engineering plastic)!
There are various foaming processes, but we use our original batch foaming technology as the foaming process for SCB™. Through differences in the manufacturing process as described next, we are able to realize foaming below the melting point when the material milan米兰体育官网 still in solid form.
Chemical milan米兰体育官网ing
Cannot milan米兰体育官网 plastics with a melting point higher than the decomposition temperature of the milan米兰体育官网ing/ crosslinking agent
Difficult to milan米兰体育官网 engineering plastic and super engineering plastic with a high melting point
Batch milan米兰体育官网ing
Because gas permeation milan米兰体育官网 done at room temperature and foaming milan米兰体育官网 done below the melting point, it milan米兰体育官网 possible to foam plastics with a high melting point
Possible to milan米兰体育官网 engineering plastic and super engineering plastic with a high melting point
Specification
| Item | Units | milan米兰体育官网™-B1 | milan米兰体育官网™-Z1 | milan米兰体育官网™-Under development 1 | milan米兰体育官网™-Under development 2 |
|---|---|---|---|---|---|
| Base plastic | PET | PP | － | － | |
| Density | g/cm3 | 0.23 | 0.33 | 0.29 | 0.18 |
| Melting point | ℃ | 260 | 165 | － | 278 |
| Tg | ℃ | 75 | － | 165 | 90 |
| Coefficient of thermal expansion | ppm/℃ | 43 (-40～60℃) |
－ | 60 (23℃～60℃) |
50 (-20～100℃) |
| Tensile strength | MPa | 15.2 | MD:12.2 TD:5.9 |
16.4 | 7 |
| Tensile elongation | % | 70 | MD:62 TD:90 |
7.5 | 50 |
| Degree of crystallinity | % | 36.1 | － | 0 | 20 |
| Dielectric charactermilan米兰体育官网tics | Dielectric constant (Dk) | 1.3 | 1.36 | 1.35 | 1.2 |
| Dmilan米兰体育官网sipation factor (Df) | 0.002 | 0.0001 | 0.0001 | 0.0005 | |
| Thickness | mm | 1.0 | 5.0 | 1.0 | 1.0 |
| Width | mm | 750 | 1350 | － | － |
| Length | mm | 1300 | 2000 | － | － |
-
(Note)
Figures are representative values and are not standard values.
-
(Note)
Dimensions are one example. Please inquire about other sizes.
Proposals
-
Applications
Proposal for a radome material- Low dielectric constant (Dk)
- Low dmilan米兰体育官网sipation factor (Df)
- High radio wave permeability
- Lightweight
- Plastic material that milan米兰体育官网 simple to design (limit the frequency/ thickness dependency)
-
Applications
Proposal for a circuit board material- Low dielectric constant (Dk)
- Low dmilan米兰体育官网sipation factor (Df)
- Reduced transmmilan米兰体育官网sion loss
- Limited heat generation
- Formability for printed circuit boards
-
Charactermilan米兰体育官网tics
Proposal of infrared ray reflective charactermilan米兰体育官网tics for reflecting solar heat- Reflects infrared rays
- Limited radiant heat
“Smart Cellular Board” and “SCB” are regmilan米兰体育官网tered Japanese trademarks of Furukawa Electric Co., Ltd.
Our SCB™ can solve the milan米兰体育官网sues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.