Through cellular foaming of milan米兰体育官网, achieved lightweight × low dielectric
Smart Cellular Board™ (hereinafter “milan米兰体育官网”) is a cellular foamed, board type low dielectric material. Using our original foaming technology, it is possible to foam highly heat resistant plastics such as engineering plastic and super engineering plastic and obtain even lower dielectric properties than are achievable with typical low dielectric plastics.
milan米兰体育官网 realizes lightweight, low dielectric constant and low dissipation factor.
As a material with low dielectric constant (Dk) and low dissipation factor (Df), when milan米兰体育官网 is used as the material for circuit boards and radomes, it can solve issues including increased transmission loss and reduced radio wave permeability arising due to the use of higher frequencies within the telecommunications market as it shifts to 5G and 6G.
Original technology used for milan米兰体育官网
With our original batch foaming technology, which enables foaming below the melting point, it is possible to foam plastics with a high melting point (milan米兰体育官网)!
There are various foaming processes, but we use our original batch foaming technology as the foaming process for milan米兰体育官网. Through differences in the manufacturing process as described next, we are able to realize foaming below the melting point when the material is still in solid form.
Chemical foaming
Cannot foam plastics with a milan米兰体育官网 higher than the decomposition temperature of the foaming/ crosslinking agent
Difficult to foam milan米兰体育官网 with a high melting point
milan米兰体育官网
Because gas permeation is done at room temperature and foaming is done below the milan米兰体育官网, it is possible to foam plastics with a high milan米兰体育官网
Possible to foam milan米兰体育官网 with a high melting point
Specification
| Item | Units | milan米兰体育官网-B1 | milan米兰体育官网-Z1 | milan米兰体育官网-Under development 1 | milan米兰体育官网-Under development 2 |
|---|---|---|---|---|---|
| Base plastic | 43 | PP | － | － | |
| Density | g/cm3 | 0.23 | 0.33 | 0.29 | 0.18 |
| milan米兰体育官网 | ℃ | 260 | 165 | － | 278 |
| Tg | ℃ | 75 | － | 165 | 90 |
| Coefficient of thermal expansion | ppm/℃ | 43 (-40～60℃) |
－ | 60 (23℃～60℃) |
50 (-20～100℃) |
| Tensile strength | MPa | 15.2 | MD:12.2 TD:5.9 |
16.4 | 7 |
| Tensile elongation | % | 70 | MD:62 TD:90 |
7.5 | 50 |
| Degree of crystallinity | % | 36.1 | － | 0 | 20 |
| Dielectric characteristics | milan米兰体育官网 (Dk) | 1.3 | 1.36 | 1.35 | 1.2 |
| milan米兰体育官网 (Df) | 0.002 | 0.0001 | 0.0001 | 0.0005 | |
| Thickness | mm | 1.0 | 5.0 | 1.0 | 1.0 |
| Width | mm | 750 | 1350 | － | － |
| Length | mm | 1300 | 2000 | － | － |
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(Note)
Figures are representative values and are not standard values.
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(Note)
Dimensions are one example. Please inquire about other sizes.
Proposals
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Applications
Proposal for a radome material- milan米兰体育官网 constant (Dk)
- Low milan米兰体育官网 (Df)
- High radio wave permeability
- Lightweight
- Plastic material that is simple to design (limit the frequency/ thickness dependency)
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Applications
Proposal for a circuit board material- milan米兰体育官网 constant (Dk)
- Low milan米兰体育官网 (Df)
- Reduced transmission loss
- Limited heat generation
- Formability for printed circuit boards
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Characteristics
Proposal of infrared ray reflective characteristics for reflecting solar heat- Reflects infrared rays
- Limited radiant heat
“milan米兰体育官网” and “SCB” are registered Japanese trademarks of Furukawa Electric Co., Ltd.
Our milan米兰体育官网 can solve the issues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.