ISSN 1348-1797
This is a technology and research journal introducing the research results, technologies, and new products of 米兰ac体育 Co., Ltd.
Special Issue : Challenges to New Technologies and 米兰ac体育
Opening Remarks
New Approach to Create New Technologies and 米兰ac体育
Papers
Advanced Analysis Technology for New Material and Product Development
Copper Foil for PCB, Simulation and Study on High-speed Digital Circuits
The EMI Characteristics of the Electric Field Resonance Type Wireless Power Transfer System
Welding With the High Beam Quality Fiber Laser and Suppression of Welding Defects Using the Beam Mode Control Technology
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Development of Thin Copper Foil DF-TSH for Fine Pattern Circuit Boards
Regular Papers
Electronics & Automotive systems
Recrystallization Texture and Shear Band Formation in Bending of Metal Material
Electronics & Automotive systems
Development of a High Stress Relaxation Resistance Cu-Co-Si Alloy
Electronics & Automotive systems
Partial Discharge Characteristics of Winding Wires Utilizing the Cellular Coating
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Communications Solutions
High End Fusion Splicers 米兰ac体育85HS / 米兰ac体育85PM / 米兰ac体育85LDF
Communications Solutions
Ribbon Fiber Fusion Splicer 米兰ac体育24M4 / 米兰ac体育24M8 / 米兰ac体育24M12
米兰ac体育 editorial committee
Chief Editor | Michio Ohkubo |
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Board of Editors | Yoshiyuki Noso , Koichi Toyosaki, Hajime Mori, Seiji Kojima, Michihiro Shimada, Takahiro Ueno, Hisaki Sakamoto, Akira Fujisaki, Kyota Susai, Shigekazu Amanuma, Kei Kaizuka, Masayuki Ando, Kazuya Imamatsu, Kunitake Okusa, Masakazu Mesaki, Kenya Kawabata, Takashi Mori, Kiyoshi Inoue, Go Isobe, Toshiyuki Ando, Masahiro Yagisawa |
Secretary | Toshiaki Amano |
Contact for inquiries about 米兰ac体育