ISSN 1348-1797

This is a technology and research journal introducing the research results, technologies, and new products of 米兰ac体育 Co., Ltd.


Special Issue : Challenges to New Technologies and 米兰ac体育

Opening Remarks

New Approach to Create New Technologies and 米兰ac体育

Papers

Advanced Analysis Technology for New Material and Product Development

Copper Foil for PCB, Simulation and Study on High-speed Digital Circuits

The EMI Characteristics of the Electric Field Resonance Type Wireless Power Transfer System

Welding With the High Beam Quality Fiber Laser and Suppression of Welding Defects Using the Beam Mode Control Technology

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Development of Thin Copper Foil DF-TSH for Fine Pattern Circuit Boards


Regular Papers

Electronics & Automotive systems

Recrystallization Texture and Shear Band Formation in Bending of Metal Material

Electronics & Automotive systems

Development of a High Stress Relaxation Resistance Cu-Co-Si Alloy

Electronics & Automotive systems

Partial Discharge Characteristics of Winding Wires Utilizing the Cellular Coating

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Communications Solutions

High End Fusion Splicers 米兰ac体育85HS / 米兰ac体育85PM / 米兰ac体育85LDF

Communications Solutions

Ribbon Fiber Fusion Splicer 米兰ac体育24M4 / 米兰ac体育24M8 / 米兰ac体育24M12

米兰ac体育 editorial committee

Chief Editor

Michio Ohkubo

Board of Editors

Yoshiyuki Noso , Koichi Toyosaki, Hajime Mori, Seiji Kojima, Michihiro Shimada, Takahiro Ueno, Hisaki Sakamoto, Akira Fujisaki, Kyota Susai, Shigekazu Amanuma, Kei Kaizuka, Masayuki Ando, Kazuya Imamatsu, Kunitake Okusa, Masakazu Mesaki, Kenya Kawabata, Takashi Mori, Kiyoshi Inoue, Go Isobe, Toshiyuki Ando, Masahiro Yagisawa

Secretary Toshiaki Amano

Contact for inquiries about 米兰ac体育