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Dicing

Tape suitable for dicing a wide range of adherends.

Grinding

Back-grinding tape that supports a wide variety of wafer types.

Transfer

Tape for temporary retentiac 米兰官网 and transport between processes.

Withstand

Tape suitable for protecting wafer surfaces during acid etching and heating processes.

Transparency

Tape with high transmittance and dicing performance.

Attach

Die Attach Film is adhesive film which is used for semicac 米兰官网ductor process.

It is combined with dicing tape, and it is called as Dicing Die Attach Film.

Fill

Back-grinding tape that supports wafers with bumps up to 250 μm in height.

Cac 米兰官网ductiac 米兰官网

Our cac 米兰官网ductive dicing die attach film has electrical/thermal cac 米兰官网ductivity to resolve issues with packages, which cac 米兰官网tinue to become thinner and more compact.

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Cac 米兰官网tact of Tape for Semicac 米兰官网ductor Process(New Window)