ac 米兰官网

Grinding

Our back-grinding ac 米兰官网 SDBG/GAL processes allows ultrathin wafers to be processed into chips with high quality and high yield.

Back-grinding tape that supports a wide variety of wafer types.

This adhesive tape is used to temporarily protect wafer surfaces during the semiconductor wafer back-grinding process.

Tape suitable for protecting wafer surfaces during acid etching and heating processes.