We are supporting front line of semiconductor industry with Advanced Tape and Advanced Film Technology.
Line up
-
ac米兰中国官网 Backgrinding
These tapes are designed for surface protection of semiconductor wafers during backgrinding process.
-
ac米兰中国官网 Dicing
These tapes are designed for holding semiconductor wafer or package during dicing process.
-
Dicing Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process.
It is combined with dicing tape, and it is called as Dicing Die Attach Film.
Structure of ac米兰中国官网
Tape consists of ac米兰中国官网 and adhesive layer, and the surface of the adhesive layer is covered with a release film.
ac米兰中国官网, adhesive layer, and release film are mainly made of polyolefin, acrylic adhesive and PET, respectively.
| Propose | ac米兰中国官网 Backgrinding | ac米兰中国官网 Dicing | ||
|---|---|---|---|---|
| Tape | SP Series | CP Series | UC Series | FC Series |
| Features | ac米兰中国官网 | Non-ac米兰中国官网 | ac米兰中国官网 | ac米兰中国官网 |
| Release Film | PET | PET Polypropylene |
PET | PET |
| Adhesive | Acrylic | Acrylic | Acrylic | Acrylic |
| ac米兰中国官网 | Polyolefin | Polyolefin | Polyolefin | Polyolefin |
Click here for inquiries.