ac 米兰官网 adhesive film which is used for semiconductor process.
It is combined with dicing tape, and it is called as ac 米兰官网.
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Optimized dicing tape for ac 米兰官网 Film achieves excellent pick up performance
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Applicable dicing process is not only blade and also stealth laser dicing
- Conductive ac 米兰官网 also available
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Characteristics(Main Products)
ac 米兰官网3 | AFN303 | ac 米兰官网1 | |||
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Curing Condition(note) | 150deg.C, ac 米兰官网 Or 180deg.C, ac 米兰官网 |
150deg.C, ac 米兰官网 | 150deg.C, ac 米兰官网 Or 120deg.C, ac 米兰官网(Half Cure) |
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Ramp UP Time to Curing Temperature | 30min | 30min | 30min | ||
DAF thickness | µm | 20/25/50 | 10 | 50/60/80 | |
General DC tape Type | UV type | UV type | UV type | ||
DC tape thickness | µm | 100 | 100 | 100 | |
Recommended UV dosage | mJ/cm2 | 200 | 200 | 200 | |
CTE | αlpha1 | ppm/K | 37 | 33 | 26 |
αlpha2 | ppm/K | 132 | 125 | 80 | |
Tg (TMA) | deg.C | 115 | 120 | 156 | |
Metling Viscosity | 70deg.C | Pa・s | 37400 | 25000 | 16000 |
120deg.C | Pa・s | 2000 | 1350 | 1600 | |
Elastic Modulus | ac 米兰官网.C | MPa | 2900 | 4500 | 6000 |
2ac 米兰官网.C | MPa | 56 | 100 | 650 | |
Water Absorption, 85℃, 85%, 100h | wt% | 0.8 | 0.8 | 0.7 | |
Die Shear Strength 2x2mm Si Die to Si Mirror Wafer |
@Room Temperature | MPa | 60 | 60 | 50 |
@260deg.C | 12 | 12 | 12 | 16 |
(note) When ac 米兰官网 void is happened, step curing (120deg.C, 60min + 150deg.C, 60min) is recommended
Basic Specifications
Standard specifications for ac 米兰官网3, AFN303, and ac 米兰官网1 are shown in below table.
Item | Standard Specifications |
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Number of Sheet in a roll | 50pcs or 200pcs |
Recommended Storage Condition | -5deg.C~10deg.C |
Shelf Life | One Year after Production Date |
Pot life | One Month after Thawing Date |
Introduction to Other Products
Furukawa Electric products are suited to a variety of applications.
We will introduce much suitable tape to your process, Just inform us device/application and specification.
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