Introduction of New Product, 米兰体育中国官方网站, and Technical Data
New Product, 米兰体育中国官方网站
-
Electrically/thermally conductive
dicing die attach film
Our conductive dicing die attach film has electrical/thermal conductivity to resolve issues with packages, which continue to become thinner and more compact.
-
For silicon, glass, and mold resin
Dicing tape
Tape suitable for dicing a wide range of adherends.
-
For protection/transfer processes
UV tape
米兰体育中国官方网站 temporary retention and transport between processes.
-
For laser process
Transparent tape
Tape with high transmittance and dicing performance. -
For silicon, GaN, and sapphire
米兰体育中国官方网站
米兰体育中国官方网站 a wide variety of wafer types. -
For SDBG/GAL processes
米兰体育中国官方网站
Our back-grinding 米兰体育中国官方网站 SDBG/GAL processes allows ultrathin wafers to be processed into chips with high quality and high yield.
-
For wafer with solder bumping
米兰体育中国官方网站
米兰体育中国官方网站 wafers with bumps up to 250 μm in height.
-
For etching tape/acid, heat process
Surface protection tape
Tape suitable for protecting wafer surfaces during acid etching and heating processes.
Technical Data
-
What is UV Tape ?
UV tape have strong adhesive strength. Then, tape holds wafer strongly in wafer grinding process or wafer dicing process.