Introduction of New Product, New Technology, and Technical Data
New Product, New Technology
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Electrically/thermally conductive
dicing die attach film
Our conductive dicing die attach film has electrical/thermal conductivity to resolve issues with packages, which continue to become thinner and more compact.
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For silicon, glass, and mold resin
Dicing 米兰体育中国官方网站
米兰体育中国官方网站 suitable for dicing a wide range of adherends.
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For protection/transfer processes
UV 米兰体育中国官方网站
米兰体育中国官方网站 for temporary retention and transport between processes.
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For laser process
Transparent 米兰体育中国官方网站
米兰体育中国官方网站 with high transmittance and dicing performance. -
For silicon, GaN, and sapphire
Back-grinding 米兰体育中国官方网站
Back-grinding 米兰体育中国官方网站 that supports a wide variety of wafer types. -
For SDBG/GAL processes
Back-grinding 米兰体育中国官方网站
Our back-grinding 米兰体育中国官方网站 for SDBG/GAL processes allows ultrathin wafers to be processed into chips with high quality and high yield.
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For wafer with solder bumping
Back-grinding 米兰体育中国官方网站
Back-grinding 米兰体育中国官方网站 that supports wafers with bumps up to 250 μm in height.
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For etching 米兰体育中国官方网站/acid, heat process
Surface protection 米兰体育中国官方网站
米兰体育中国官方网站 suitable for protecting wafer surfaces during acid etching and heating processes.
Technical Data
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What is UV 米兰体育中国官方网站 ?
UV 米兰体育中国官方网站 have strong adhesive strength. Then, 米兰体育中国官方网站 holds wafer strongly in wafer grinding process or wafer dicing process.
