国际米兰中文官网pper foil list by application

Among the Furukawa Electric's 国际米兰中文官网s, the 国际米兰中文官网s for the printed wiring boards are introduced according to application.

Application	Type	Profile	Manufacturing location	Thickness (μm)
Application	Type	Profile	Manufacturing location	6	9	12	18	35	70	105～
High-frequency substrate	DGTSEU2-MP	RTF	Taiwan			○	○	○
	FT2-UP	VLP	Taiwan				○	○
	FT1-UP	H-VLP	Taiwan				○	○
	FV/FHG-WS	H-VLP	Japan			○	○	○
	FZ-WS	H-VLP2	Japan			○	○	○
Flexible printed circuit boards	F2-WS	VLP	Japan		○	○	○	○
	F3-WS	VLP	Japan			○			○
	FWL-WS	VLP	Japan			○	○
Package substrate	GTS-MP	Standard foil	Taiwan			○	○	○	○
	F3-WS	VLP	Japan			○			○
	DF-TSH	VLP	Japan	○	○
High-density multi-layer circuit board	GTS-MP	Standard foil	Taiwan			○	○	○	○
High-density multi-layer circuit board	DF-TSH	VLP	Japan	○	○
Large-current substrate	GTS-STD	Standard foil	Japan							○(～210μm)