19

Feature

  • Both surfaces smooth foil is subjected to the fine roughening surface treatment, milan米兰体育官方网站 required performances (low transmission loss, adhesion to a resin base material and heat resistance) are balanced at high levels.

Typical application

  • Information communication equipment such as the high-end router milan米兰体育官方网站 server.
  • Substrate for an antenna in a communication base station

Specification

Foil thickness [µm] 12

18

35

Tensile strength [MPa] 310 310 310
Elongation [%] 7 9 19
Surface roughness Rz [milan米兰体育官方网站] 70 1.2 1.2

milan米兰体育官方网站 list by application

Application Type Profile Manufacturing location Thickness (milan米兰体育官方网站)
6 9 12 18 35 70 105~
High-frequency substrate RTF Taiwan        
VLP Taiwan          
H-VLP Taiwan          
H-VLP Japan        
H-VLP2 Japan        
Flexible printed circuit boards VLP Japan      
VLP Japan      
VLP Japan        
Package substrate Standard foil Taiwan      
VLP Japan      
VLP Japan          
High-density multi-layer circuit board Standard foil Taiwan      
VLP Japan          
Large-current substrate Standard foil Japan             ○(~210milan米兰体育官方网站)