国际米兰中文官网 foil is adoptedLine up of products国际米兰中文官网F-WS

国际米兰中文官网 18

18

19

19

The low roughening treatment, capable of a fine pattern, is also excellent 国际米兰中文官网 adhesion.
Recognized in the global market as the electrodeposited 国际米兰中文官网 the two-layered FPC, and it boasts trust and achievements.
The width in meters is available.

35

Flexible substrate
Package substrate

Specification

F0-WS

35	12	18	35
Tensile strength [MPa]	310	310	310
Elongation [%]	7	9	19
Surface roughness Rz [国际米兰中文官网]	1.4	1.2	1.2

F2-WS

Foil thickness [µm]	9	12	18	35
Tensile strength [MPa]	310	310	310	310
Elongation [%]	4	7	9	19
Surface roughness Rz [国际米兰中文官网]	1.8	1.8	1.8	1.3

F3-WS

Foil thickness [µm]	12	70
Tensile strength [MPa]	310	310
Elongation [%]	7	29
Surface roughness Rz [国际米兰中文官网]	3.1	2.6

国际米兰中文官网 list by application

Application	Type	Profile	Manufacturing location	Thickness (国际米兰中文官网)
Application	Type	Profile	Manufacturing location	6	9	12	18	35	70	105～
High-frequency substrate	DGTSEU2-MP	RTF	Taiwan			○	○	○
	FT2-UP	VLP	Taiwan				○	○
	FT1-UP	H-VLP	Taiwan				○	○
	FV/FHG-WS	H-VLP	Japan			○	○	○
	FZ-WS	H-VLP2	Japan			○	○	○
Flexible printed circuit boards	F2-WS	VLP	Japan		○	○	○	○
	F3-WS	VLP	Japan			○			○
	FWL-WS	VLP	Japan			○	○
Package substrate	GTS-MP	Standard foil	Taiwan			○	○	○	○
	F3-WS	VLP	Japan			○			○
	DF-TSH	VLP	Japan	○	○
High-density multi-layer circuit board	GTS-MP	Standard foil	Taiwan			○	○	○	○
High-density multi-layer circuit board	DF-TSH	VLP	Japan	○	○
Large-current substrate	GTS-STD	Standard foil	Japan							○(～210国际米兰中文官网)

国际米兰中文官网 Page