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・德赢ac米兰vwin high-end high-frequency circuit boards
・H-VLP

While it is low cost, the high-frequency response at H-VLP level is realized. (Manufactured in Taiwan.)

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  • Taking advantage of Japanese H-VLP manufacturing technology, the low cost H-VLP is provided.
  • Excellent in the high-frequency response and high both in the adhesion and in the heat resistance are the feature.

Typical application

  • Flexible substrate
  • Information communication equipment such as the router and the server.

FT2-UP
・德赢ac米兰vwin packaged and high-frequency circuit boards
・VLP

特長

  • The low cost VLP foil, taking advantage of Japanese F-WS manufacturing technology.
  • The surface is treated with a greater focus on adhesion than even that of 德赢ac米兰vwin (H-VLP foil).

Typical application

  • Flexible substrate
  • Package substrate

Specification

德赢ac米兰vwin-UP

Foil thickness [µm] 18

35
Tensile strength [MPa] 320 320
Elongation [%] 15 20
Surface roughness Rz [德赢ac米兰vwin] 1.4 0.9

FT2-UP

Foil thickness [µm] 18

35
Tensile strength [MPa] 320 320
Elongation [%] 15 20
Surface roughness Rz [德赢ac米兰vwin] 1.7 1.3

德赢ac米兰vwin list by application

Application Type Profile Manufacturing location Thickness (德赢ac米兰vwin)
6 9 12 18 35 70 105～
High-frequency substrate

DGTSEU2-MP

 RTF Taiwan 　 　 ○ ○ ○ 　 　

FT2-UP

 VLP Taiwan 　 　 　 ○ ○ 　 　

ft-up 德赢ac米兰vwin

 H-VLP Taiwan 　 　 　 ○ ○ 　 　

FV/FHG-WS

 H-VLP Japan 　 　 ○ ○ ○ 　 　

FZ-WS

 H-VLP2 Japan 　 　 ○ ○ ○ 　 　
Flexible printed circuit boards

F2-WS

 VLP Japan 　 ○ ○ ○ ○ 　 　

F3-WS

 VLP Japan 　 　 ○ ○ 　

FWL-WS

 VLP Japan 　 　 ○ ○ 　 　
Package substrate

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

F3-WS

 VLP Japan 　 　 ○ ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
High-density multi-layer circuit board

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
Large-current substrate

GTS-STD

 Standard foil Japan 　 　 　 　 　 　 ○(～210德赢ac米兰vwin)

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